FIB Dual beam SEM Tescan
The TESCAN LYRA III is a dual beam system that combines the high-resolution imaging capabilities of a field-emission SEM (FEG-SEM) with the precision milling and modification abilities of a focused ion beam (FIB). The tool allows in-situ modification and surface characeriaztion of wide range of samples. Also DB system equipped with energy dispersive spectroscopy (EDS) by Bruker combines high-resolution imaging with precise elemental analysis. This integration is widely used in materials science, nanotechnology, failure analysis, and quality control.
General Specifications
System Type: Dual Beam (FIB-SEM)
Electron Source: Field Emission Gun (FEG)
Ion Source: Gallium (Ga) liquid metal ion source (LMIS)
Specification
Electron Column (SEM) - Electron Beam Energy Range
0.2 to 30 kV
Electron Column (SEM) - Resolution
At High Voltage: ~1.0 nm at 30 kV
At Low Voltage: ~1.8 nm at 1 kV
Electron Column (SEM) - Beam Current Range
1 pA to several nA (adjustable for imaging and analysis)
Electron Column (SEM) - Detectors
InBeam SE (Secondary Electron)
InBeam BSE (Backscattered Electron)
Optional detectors for EDS, CL (Cathodoluminescence), and EBSD integration.
Ion Column (FIB) - Ion Beam Energy Range
2 to 30 kV
Ion Column (FIB) - Resolution
~5 nm at 30 kV
Ion Column (FIB) - Beam Current Range
From tens of pA to several nA (tunable for precise milling and deposition)
Ion Column (FIB) - Ion Beam Capabilities
Precise milling and cross-sectioning
Ion-beam-induced deposition (IBID)
Ion-beam-induced etching (IBIE)
Chamber and Stage - Chamber Design
Large chamber with an open geometry to accommodate additional analytical tools.
Optimized for dual-beam workflows.
Chamber and Stage - Stage Travel
X/Y: ~100 mm
Z: ~50 mm
Rotation: 360° continuous
Tilt: -10° to +60° (for FIB-SEM positioning)
Chamber and Stage - Sample Size
Can accommodate samples up to ~150 mm in diameter, depending on configuration.
