Optical litography + 3D laser confocal microscope
Mask alignment system EVG 610
The EVG®610 is a compact and multi-purpose R&D system that can handle small substrate pieces and wafers up to 75 mm. The EVG610 supports a variety of standard lithography processes, such as vacuum-, hard-, soft-, and proximity exposure modes, with the option of back-side alignment. Moreover the system offers additional capabilities including soft UV nanoimprint lithography (NIL). Exposure optics includes an UV-LED light source with low energy consumption and long lifetime.
3D Laser Scanning Microscope VK-X3000 Series
The confocal microscope is capable of laser-based detection of light intensity and height. It is equipped with CMOS camera for obtaining color information. Using MultiFile Analyzer SW the system is capable of quantitative feature analysis, line & surface roughness measurement. For tribology and wear studies the material loss can be quantified easily with the volume measurement function. Larger area observation via image stitching capability.
Specification
Minimum feature size to pattern
<0.7 um at vacuum contact mode
<2 um at soft contact mode
UV light source
LED light 365 nm
no CDA, no active exhaust required
Exposure modes: constant power, constant time, constant intensity, constant dose
Alignment capabilities
large gap >50 um between mask and target (1-1000 um)
wafer thickness up to 10 mm
top and bottom side microscopes (includes IR light source)
top side alignment accuracy < 0.5 um
bottom side alignment accuracy < 2 um
IR alignment accuracy < 2 um
3x3" and 4x4" mask holders
small pieces, 2" and 3" wafer chucks
Laser confocal and focus variation modes
Objectives
5x, 10x, 20x, 50x, 150x
White light illumination
circular, coaxial and mixed
Semiconductor laser
661 nm, 1mW
White LED light source
Motorized x,y,z sample stage
x,y - range 100 x 100 mm, z-range 25 mm
Field of view
11 x 7398 um
Height accuracy
0.2 um
