PVD magnetron sputtering system (TiO2)

Reactive magnetron sputtering system for TiO2 thin film deposition

Reactive PVD equipment for preparing TiO₂ thin films involves a magnetron sputtering system combined with a reactive gas (oxygen) in the deposition chamber. A titanium target is sputtered using an inert gas like argon, while oxygen reacts with the sputtered titanium atoms to form titanium dioxide (TiO₂) on the substrate. This method allows precise control over the film's composition, thickness, and properties by adjusting parameters such as oxygen flow, sputtering power, and substrate temperature. TiO₂ thin films prepared by reactive sputtering are widely used as gas sensing layers in metal oxide semiconductor gas sensors due to their high sensitivity and stability, as well as in various photocatalytic applications.