Thermal evaporation system
Thermal and e-beam evaporation system allowing for ion beam assisted deposition. The system is designed as two separate chambers including gate valve between. Each of the chambers has own evacuation system with turbomolecular and scroll pump (base pressure <10-5Pa) . The design allows for independent loading of source material and samples.
In the bottom chamber thermal and e-beam evaporation sources are situated. Thermal evaporation remains from two sources (boats) powered by one supply. E-beam gun is equipped with six pockets (acceleration voltage 10kV, maximal power 4kW, Ferrotec). Each source has its own thickness monitor and is equipped with pneumatic shutter controlled by computer. In this way multilayer or co – deposition is enabled.
The upper chamber contains sample holder, additional thickness monitor and ion gun. Sample holder has independent motion around two axes (tilt and rotation) and resistive heating up to 700°C. Allowable sample size corresponds to 2 inch wafer or multiple (9 pieces 10 mm x 10 mm). Ion beam assisted deposition can be performed by using End – Hall (gridless) ion gun (The Kaufman & Robinson, Inc (KRI®) eHF series). Automated gas inlet system gives the possibility to select between two gases.
